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Nanoveu’s EMASS Enters Chip Synthesis Phase

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ECS-DoT system-on-chip development marks significant milestone for AIoT platform

Nanoveu’s (ASX: NVU) subsidiary, Embedded AI Systems (EMASS), has advanced to the chip synthesis phase of its flagship ECS-DoT artificial intelligence of things (AIoT) system-on-chip (SoC) development. This progression follows the completion of a full back-end design flow, achieved in collaboration with Egypt’s Centre of Nanoelectronics. Nanoveu is a technology company that creates innovative solutions, including antiviral protection and custom hardware and software for AI applications. Its EMASS division focuses on AIoT solutions, particularly in edge computing environments.

The new chip leverages the advanced 16 nanometre FinFET process node from Taiwan Semiconductor Manufacturing Company, representing a notable upgrade from EMASS’s existing 22nm prototype. This enhancement delivers lower power consumption, improved performance, and a smaller chip size, all crucial attributes for AI deployment in energy-constrained environments. EMASS founder Professor Mohamed M. Sabry Aly stated that chip synthesis signifies a major step in transitioning from simulation to silicon, positioning ECS-DoT for deployment in miniaturised, always-on intelligent systems.

EMASS has also launched its modular AIoT development kit, offering plug-and-play daughter cards to expedite prototyping in applications such as predictive maintenance, healthcare, and asset tracking. Each module includes schematics, hardware abstraction libraries, and containerised pre-trained AI models to streamline application development. To further accelerate commercial adoption, EMASS has released a beta SDK with APIs, documentation, and engineering support through an early access developer program.

According to Nanoveu semiconductor division chief executive officer Mark Goranson, the modular kit addresses the rising demand for turnkey AIoT integrations at the edge. He noted that ECS-DoT provides the performance, power efficiency, and compact form factor necessary to drive transformative applications in power-sensitive environments. Select partners will receive evaluation hardware and direct support this quarter, prior to a broader commercial release.

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